MesoGlue is our revolutionary joining solution that allows for the attachment of items together with a metal bond, at low temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
MesoGlue Phase I:
The Phase I technology provides the best control of the bond and the highest quality of connections. It requires the use of a high vacuum chamber for the application of the glue.
Phase I technology can be applied to nearly any flat surface, which can be rigid or flexible, and roll-to-roll processing is possible.
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure (100-1000psi) or temperature (20-100oC).
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only light pressure (<100psi).
MesoGlue Phase II:
With the Phase II technology, we move the process out of the vacuum chamber onto a desktop. This makes it much less expensive and easier to use.
MesoGlue Liquid is our patent pending process to produce bonds between items with an all metal connection. We combine the principles of a 2-part epoxy with hot gluing to make a simple to use solution. Our room temperature formula is a safe and simple for soldering, metal repairs, and 3D printing of metals. Our high temperature formula is stable to higher temperatures for more demanding situations such as electronics in extreme environments or wide-bandgap semiconductors.