Technology

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MesoGlue

  • Revolutionary joining solution allows for the attachment of items together with a metal bond, at low temperature.
  • Like welding or soldering, but without the heat
  • Patented process gives the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of two-part glue (like epoxy).
  • No out-gassing, No toxic metals

 

What We Offer:

  • Engineered bonding and sealing solutions, integrated into your manufacturing process flow to meet product specific performance metrics
  • Engineered turn-key bonding and sealing systems and process station design
  • Collaborate with leading institutes to provide in-house application support to tailor the bonding solutions to meet your specific needs
  • Licensing of technology as well as sales of glue ready to be used
  • Highly skilled technical team

MesoGlue Phase I

The Phase I technology provides the best control of the bond and the highest quality of connections. It requires the use of a high vacuum chamber for the application of the glue.

Phase I technology can be applied to nearly any flat surface, which can be rigid or flexible, and roll-to-roll processing is possible.

MesoGlue Silver:


silver

A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure (100-1000 psi) or temperature (20-100ºC).

 

 

MesoGlue Eutectic:

A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only light pressure (<100 psi).

 

 

 


MesoGlue Phase II

With the Phase II technology, we move the process out of the vacuum chamber onto a desktop. This makes it much less expensive and easier to use.

MesoGlue Liquid:

MesoGlue Liquid is our patent pending process to produce bonds between items with an all metal connection. We combine the  principles of a 2-part epoxy with hot gluing to make a simple to use solution. Our room temperature formula is a safe and simple for soldering, metal repairs, and 3D printing of metals. Our high temperature formula is stable to higher temperatures for more demanding situations such as electronics in extreme environments or wide-bandgap semiconductors.