Thermal Interface Material


MesoGlue metallic glues can be used as a thermal interface material to connect a CPU or other power dense devices to a heat sink. This eliminates many of the problems that are encountered when seeking suitable attachment methods.

  • Metallic glue can be used on aluminum or copper heat sinks, and can be attached to heat-spreaders or to silicon dies.
  • Metallic glue has a very high thermal conductivity (300-425 W/m*K ) as compared to common thermal greases (~1-10 W/m*K ) allowing much more effective heat transfer from the CPU to the heat sink.
  • Metallic Glue experiences no pump-out or drying problems.

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